METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD

Title:

METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2018/135490

Kind Code:

A1

Abstract:

Disclosed is a method for producing a ceramic circuit board which is provided with a ceramic substrate and a metal circuit that is formed on the ceramic substrate. The disclosed method comprises: a step for forming a first metal layer that is in contact with the ceramic substrate by spraying a first metal powder onto the surface of the ceramic substrate together with an inert gas from a nozzle, said first metal powder containing aluminum particles and/or aluminum alloy particles, wherein the first metal powder is heated to 10-270°C and is subsequently sprayed from a nozzle 10, with the gauge pressure of the inert gas at the entrance of the nozzle 10 being 1.5-5.0 MPa; a step for subjecting the first metal layer to a heat treatment in an inert gas atmosphere; and the like.

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Inventors:

SAKAI ATSUSHI (JP)
TANIGUCHI YOSHITAKA (JP)
YAMADA SUZUYA (JP)

Application Number:

PCT/JP2018/001022

Publication Date:

July 26, 2018

Filing Date:

January 16, 2018

Export Citation:

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Assignee:

DENKA COMPANY LTD (JP)

International Classes:

H05K3/14; B22F1/00; B22F3/04; B32B15/04; B32B37/02; C22C9/00; C22C21/00; C23C24/04

Domestic Patent References:

WO2015064430A1	2015-05-07
WO2016021561A1	2016-02-11

Foreign References:

JP2013018190A	2013-01-31
JP2016152324A	2016-08-22
JP2009197294A	2009-09-03
JPH11251698A	1999-09-17
JP2013018190A	2013-01-31

Other References: