Title:
METHOD FOR PRODUCING CIRCUIT CONNECTION STRUCTURE, AND CIRCUIT CONNECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/234056
Kind Code:
A1
Abstract:
A method for producing a circuit connection structure 40, the method comprising: a step (a) for positioning a circuit connection material provided with a solder connection material 1 and an adhesive agent on a first circuit member 10 having a first electrode 12, specifically on a surface of the first circuit member 10 where the first electrode 12 is formed; a step (b) for positioning a second circuit member 20 having a second electrode 22 on the first circuit member 10 such that the first electrode 12 and the second electrode 22 face one another; a step (c) for thermally pressure bonding the first circuit member 10 and the second circuit member 20 at a temperature that is equal to or greater than the melting point of the solder connection material 1 in a state in which the solder connection material 1 is interposed between the first electrode 12 and the second electrode 22; and a step (d) for cooling the first electrode 12 and the second electrode 22, while increasing pressure between the same, until the temperature between the first electrode 12 and the second electrode 22 falls from the temperature that is equal to or greater than the melting point of the solder connection material 1 to a temperature that is equal to or less than the melting point of the solder connection material 1.
Inventors:
MORIJIRI TOMOKI (JP)
IZAWA HIROYUKI (JP)
SATO MAYUMI (JP)
ITOH YUKA (JP)
IZAWA HIROYUKI (JP)
SATO MAYUMI (JP)
ITOH YUKA (JP)
Application Number:
PCT/JP2023/018615
Publication Date:
December 07, 2023
Filing Date:
May 18, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/60; H01B1/24; H01B13/00; H05K3/36
Foreign References:
| JPS61174643A | 1986-08-06 | |||
| JP2008072038A | 2008-03-27 | |||
| JP2008153399A | 2008-07-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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