METHOD FOR PRODUCING CIRCUIT WIRING LINE, METHOD FOR PRODUCING TOUCH PANEL, AND METHOD FOR PRODUCING SUBSTRATE HAVING PATTERN

WIPO Patent Application WO/2019/074112

A1

One embodiment of the present invention provides a method for producing a circuit wiring line and a method for producing a substrate having a pattern, each of which comprises: a step wherein a photosensitive transfer material, which has a provisional supporting body and a photosensitive resin layer, is bonded to a substrate, which has a conductive layer, such that the photosensitive resin layer of the photosensitive transfer material is in contact with the substrate; a step wherein the provisional supporting body is separated from the photosensitive resin layer that has been bonded in the bonding step; a step wherein a photomask is brought into contact with the photosensitive resin layer, from which the provisional supporting body has been separated, and the photosensitive resin layer is subjected to pattern exposure; a step wherein a pattern is formed by developing the photosensitive resin layer after the pattern exposure; and a step wherein the conductive layer that is exposed from the photosensitive resin layer in regions where the pattern is not formed is etched. The surface of the photomask used in the pattern exposure step, said surface being in contact with the photosensitive resin layer, has a protective layer that contains particles which are in a solid state at 25°C at 1 atmosphere.

KATAYAMA AKIO (JP)
KANNA SHINICHI (JP)

PCT/JP2018/038181

April 18, 2019

October 12, 2018

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FUJIFILM CORP (JP)

G03F1/48; G03F7/004; G03F7/039; G03F7/20; H01L21/027; H05K3/06

JP2017156735A	2017-09-07
JP2000273412A	2000-10-03
JP2008292655A	2008-12-04
JP2008262231A	2008-10-30
JP2015166866A	2015-09-24
JP2017078852A	2017-04-27

TAIYO, NAKAJIMA & KATO (JP)

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