METHOD FOR PRODUCING CIRCULAR WAFER BY MEANS OF USING GRINDING TAPE TO GRIND EDGE OF WAFER COMPRISING CRYSTALLINE MATERIAL AND HAVING NOTCHED SECTION SUCH AS ORIENTATION FLAT

Title:

METHOD FOR PRODUCING CIRCULAR WAFER BY MEANS OF USING GRINDING TAPE TO GRIND EDGE OF WAFER COMPRISING CRYSTALLINE MATERIAL AND HAVING NOTCHED SECTION SUCH AS ORIENTATION FLAT

Document Type and Number:

WIPO Patent Application WO/2014/125844

Kind Code:

A1

Abstract:

Provided is a method for producing a circular wafer by using a grinding tape to grind the edge of a wafer comprising a crystalline material. The present invention includes: a primary grinding step for contacting a grinding body to the peripheral portion of a wafer placed centered on a horizontal stage having a vertical rotational axis and rotating the stage, thus grinding the peripheral portion; a step for measuring the radius of the wafer, setting a radius that is no greater than the measured smallest radius, and determining the difference (Δr) between the set radius and the measured wafer radius along the peripheral portion; a step for determining the portions of the peripheral portion at which Δr is greater than a predetermined value; and a secondary grinding step for contacting the peripheral portion and the grinding body, rotating the stage forwards and backwards in a predetermined range of rotational angles, and grinding the peripheral portion. The grinding body contains a grinding tape disposed at a flat grinding pad and demarcating a flat grinding surface, and in the secondary grinding step, the stage and grinding surface are rocked relative to each other along a horizontal axis line, reducing the speed of the forward and backward rotation of the stage within a range of rotational angles corresponding to the determined section of the peripheral portion.

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Inventors:

YAMAGUCHI NAOHIRO (JP)

Application Number:

PCT/JP2014/050097

Publication Date:

August 21, 2014

Filing Date:

January 08, 2014

Export Citation:

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Assignee:

MIPOX CORP (JP)

International Classes:

B24B9/00; B24B21/16; H01L21/304

Foreign References:

JP2008537317A	2008-09-11
JP2007000945A	2007-01-11
JPH05217830A	1993-08-27
US4638601A	1987-01-27
JPH10100050A	1998-04-21
JP2006303112A	2006-11-02
JP4463326B2	2010-05-19

Other References: