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Patent Searching and Data


Title:
METHOD FOR PRODUCING COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/027041
Kind Code:
A1
Abstract:
The present invention provides a method for producing a composite material which is improved in terms of dispersibility of an exfoliated layered substance into a resin or the like, and which enables the achievement of a synthetic resin that has considerably improved physical properties such as impact resistance. A method for producing a composite material that is obtained by covering the surface of an exfoliated layered substance with a cover material, said method comprising a crushing step wherein secondary particles of the exfoliated layered substance are crushed in a solution that contains the cover material; or a method for producing a composite material that is obtained by covering the surface of an exfoliated layered substance with a cover material, said method comprising a crushing step wherein secondary particles of the exfoliated layered substance are crushed in a solvent, and a dissolution step wherein the cover material is dissolved into a dispersion liquid that contains the crushed exfoliated layered substance.

Inventors:
SAIKI TOMOAKI (JP)
TANIUCHI RYO (JP)
NOHARA YUTA (JP)
TATEISHI HIKARU (JP)
YOKOTA HIDEYUKI (JP)
YANO TORU (JP)
Application Number:
PCT/JP2019/029632
Publication Date:
February 06, 2020
Filing Date:
July 29, 2019
Export Citation:
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Assignee:
ADEKA CORP (JP)
International Classes:
C09C3/04
Domestic Patent References:
WO2016088682A12016-06-09
WO2013172350A12013-11-21
Foreign References:
JP2012240891A2012-12-10
JPS5956435A1984-03-31
CN107381643A2017-11-24
JP2018070412A2018-05-10
JPS59156903A1984-09-06
JP2018177549A2018-11-15
JP2016531824A2016-10-13
JP2016060887A2016-04-25
US20160101980A12016-04-14
US20120301707A12012-11-29
US20130296479A12013-11-07
US20140272350A12014-09-18
US20180186954A12018-07-05
US20160200580A12016-07-14
Other References:
See also references of EP 3831892A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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