Title:
METHOD FOR PRODUCING CONDUCTIVE ADHESIVE FILM, CONDUCTIVE ADHESIVE FILM, AND METHOD FOR PRODUCING CONNECTION BODY
Document Type and Number:
WIPO Patent Application WO/2015/016169
Kind Code:
A1
Abstract:
In the present invention, conductive particles filling openings are reliably transferred to a binder resin layer. The present invention has: a step for filling a plurality of openings (12) formed in a predetermined pattern at the surface of a substrate (11) with a solvent (13) and conductive particles (3); a step for pasting the surface to which the binder resin layer (7) has been formed of the adhesive film (8) resulting from the binder resin layer (7) being formed at a base film (4) to the surface to which the openings (12) are formed of the substrate (11); and a step for peeling the adhesive film (8) from the surface of the substrate (11) while heating the substrate (11), thus transferring the conductive particles (3) filling the interior of the openings (12) to the binder resin layer (7).
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Inventors:
AKUTSU YASUSHI (JP)
Application Number:
PCT/JP2014/069795
Publication Date:
February 05, 2015
Filing Date:
July 28, 2014
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J7/22; C09J7/30; C09J9/02; C09J11/04; C09J201/00; H01B5/16; H01B13/00; H01R43/00; H05K3/32
Domestic Patent References:
| WO2014021424A1 | 2014-02-06 | |||
| WO2014030753A1 | 2014-02-27 |
Foreign References:
| JP2008186761A | 2008-08-14 | |||
| JP2009535843A | 2009-10-01 | |||
| JP2005209454A | 2005-08-04 | |||
| JP2004335663A | 2004-11-25 | |||
| JP2002519473A | 2002-07-02 |
Attorney, Agent or Firm:
NOGUCHI, NOBUHIRO (JP)
Nobuhiro Noguchi (JP)
Nobuhiro Noguchi (JP)
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