Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE FILM, TOUCH PANEL SENSOR AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2018/042979
Kind Code:
A1
Abstract:
The present invention addresses the problem of easily producing a conductive film which is provided with a thin metal wire that has a narrow line width, while exhibiting excellent adhesion to a substrate. A method for producing a conductive film according to the present invention sequentially comprises, in the following order: a step for forming a first metal film on at least one main surface of a substrate; a step for forming a second metal film, which contains a main component that is different from the main component of the first metal film, on the first metal film; a step for forming a resist film, which is provided with an opening part having a line width of 2.0 μm or less, in a region on the second metal film, where a thin metal wire is to be formed; a step for forming a third metal film; a step for removing the resist film; a step for removing the second metal film with use of a second etching liquid, while using the third metal film as a mask; and a step for removing the first metal film with use of a first etching liquid, while using the third metal film as a mask.

Inventors:
ICHIKI Takahiko (577 Ushijima, Kaisei-machi, Ashigara-kami-gu, Kanagawa 77, 〒2588577, JP)
Application Number:
JP2017/027456
Publication Date:
March 08, 2018
Filing Date:
July 28, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
International Classes:
G06F3/041; B32B7/02; H01B5/14; H01B13/00
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (Yusen Iwamoto-cho Bldg. 6F, 3-3 Iwamoto-cho 2-chome, Chiyoda-k, Tokyo 32, 〒1010032, JP)
Download PDF: