Title:
METHOD FOR PRODUCING CONDUCTIVE FILM, AND CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2019/138706
Kind Code:
A1
Abstract:
Provided is a method for producing a conductive film, which comprises: an application step for forming a coating film by applying a composition for forming a conductive film to the surface of a substrate, said composition containing copper particles, at least one reducing agent that is selected from the group consisting of reductones and hydroxycarboxylic acids that have two or more carboxy groups and one or more hydroxy groups in each molecule, and a dispersion medium; a drying step for obtaining a dried film on the substrate by drying the coating film in an oxidizing atmosphere at a temperature of 150°C or less, said dried film being composed of a lower layer that does not substantially contain an oxide of copper and an upper layer that is arranged on the lower layer and contains an oxide of copper; and a separation step for obtaining a conductive film by removing the upper layer from the dried film. Also provided is a conductive film.
Inventors:
OMURA KAZUFUMI (JP)
Application Number:
PCT/JP2018/043490
Publication Date:
July 18, 2019
Filing Date:
November 27, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B13/00; C09D5/24; H01B1/22; H01B5/14
Domestic Patent References:
| WO2018190246A1 | 2018-10-18 |
Foreign References:
| JP2014227510A | 2014-12-08 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF: