Title:
METHOD FOR PRODUCING CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2019/167396
Kind Code:
A1
Abstract:
Provided is a method for producing a conductive film which is provided with a conductive film-forming step for forming a conductive film by contacting an insulative coating film which contains copper particles and a copper particle fusion promoter with one another, wherein it is possible to form a conductive film at a low temperature, and the formed conductive film exhibits excellent conductivity.
Inventors:
OMURA KAZUFUMI (JP)
Application Number:
PCT/JP2018/046744
Publication Date:
September 06, 2019
Filing Date:
December 19, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B13/00; C09D1/00; C09D7/61; C09D7/63; C09D201/00; H01B1/22; H05K3/12
Foreign References:
| JP2015530693A | 2015-10-15 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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