METHOD FOR PRODUCING CONDUCTIVE METAL PARTICLES AND CONDUCTIVE PASTE

WIPO Patent Application WO/2014/141741

A1

The present invention provides: a conductive paste which enables easy formation of a fine wiring pattern that exhibits more excellent conductivity; and a method for producing conductive metal particles that are used for the conductive paste. Provided is a conductive paste which contains conductive metal particles (A), a thermosetting resin composition (B) and an organic solvent (C) that is not reactive with the component (B) and has a boiling point of 170-300°C at atmospheric pressure. This conductive paste is characterized in that metal particles having a median diameter (D50) of 0.1-10 μm, each of said particles having a moiety wherein a fatty acid having 6-24 carbon atoms is bonded with a metal, are used as the conductive metal particles (A). Also provided is a method for producing conductive metal particles for the conductive paste, wherein metal particle mixture that contains a free fatty acid having 6-24 carbon atoms and metal particles, each of which has a moiety wherein the fatty acid having 6-24 carbon atoms is bonded with a metal, is heated, so that the free fatty acid having 6-24 carbon atoms is removed therefrom.

SENTE YASUHIRO (JP)
KATAYAMA YOSHINORI (JP)

PCT/JP2014/051074

September 18, 2014

January 21, 2014

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DAINIPPON INK & CHEMICALS (JP)

H01B1/22; B22F1/102; B22F9/00; C08K9/04; C08L101/00; H01B1/00; H01B13/00

WO2005037465A1

2005-04-28

JP2011100573A	2011-05-19
JP2012054103A	2012-03-15
JP2012185944A	2012-09-27
JP2012052225A	2012-03-15
JP2012046779A	2012-03-08
JP2009289745A	2009-12-10
JP2013147720A	2013-08-01

KONO MICHIHIRO (JP)
Michihiro Kono (JP)

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