Title:
METHOD FOR PRODUCING CONDUCTOR, METHOD FOR PRODUCING WIRING BOARD, AND COMPOSITION FOR FORMING CONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2018/212345
Kind Code:
A1
Abstract:
A method for producing a conductor, which comprises: a step for forming a composition layer by applying a composition to a substrate, said composition containing a first copper complex that is formed from a keto acid and a copper ion and a second copper complex that is formed from a copper ion and a ligand containing a nitrogen atom; and a step for having copper precipitated by irradiating the composition layer with a laser beam.
Inventors:
OHISHI TOMOJI (JP)
Application Number:
PCT/JP2018/019372
Publication Date:
November 22, 2018
Filing Date:
May 18, 2018
Export Citation:
Assignee:
SHIBAURA INST TECH (JP)
International Classes:
C23C18/14; B22F3/105; B22F9/30; B33Y10/00; H01L21/28; H01L21/288; H05K3/10; H05K3/12
Foreign References:
| JP2004277868A | 2004-10-07 | |||
| JP2010534932A | 2010-11-11 | |||
| JP2011243436A | 2011-12-01 | |||
| JP2014196384A | 2014-10-16 |
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (JP)
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