Title:
METHOD FOR PRODUCING CONNECTED BODY, METHOD FOR CONNECTING ELECTRONIC COMPONENT, AND CONNECTED BODY
Document Type and Number:
WIPO Patent Application WO/2016/117613
Kind Code:
A1
Abstract:
To connect an electronic component at low temperatures by using a photocurable adhesive and to prevent alignment deviation of the electronic component.
A method for producing a connected body, which comprises: an adhesive arrangement step wherein an adhesive for circuit connection 1 that contains a photopolymerization initiator is arranged on a transparent substrate 12; a temporary compression bonding step wherein an electronic component 18 is arranged on the transparent substrate 12 with the adhesive for circuit connection 1 being interposed therebetween, and the adhesive for circuit connection 1 is irradiated with light, while pressing the electronic component 18 against the transparent substrate 12; and a main compression bonding step wherein heating and light irradiation are carried out, while pressing the electronic component 18 against the transparent substrate. In this connection, the amount of light irradiated during the temporary compression bonding step is smaller than the amount of light irradiated during the main compression bonding step.
Inventors:
KAJITANI TAICHIRO (JP)
HIRAO MIKI (JP)
HIRAO MIKI (JP)
Application Number:
PCT/JP2016/051595
Publication Date:
July 28, 2016
Filing Date:
January 20, 2016
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L21/60; C09J5/00; C09J5/06; C09J9/02; C09J11/06; C09J201/02; H05K3/32
Foreign References:
| JP2014202821A | 2014-10-27 | |||
| JP2007045900A | 2007-02-22 | |||
| JP2013105636A | 2013-05-30 | |||
| JP2013058412A | 2013-03-28 |
Attorney, Agent or Firm:
NOGUCHI, NOBUHIRO (JP)
Nobuhiro Noguchi (JP)
Nobuhiro Noguchi (JP)
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