Title:
METHOD FOR PRODUCING CONNECTED BODY, AND CONNECTED BODY
Document Type and Number:
WIPO Patent Application WO/2023/013529
Kind Code:
A1
Abstract:
A connector manufacturing method with excellent production efficiency is provided. This connector manufacturing method involves processes 1 and 2 below. Step 1: a step in which a coating liquid for a conductive adhesive agent layer, which contains an adhesive agent and conductive particles with a conductive layer on the surface of the resin core, is coated on a first metal substrate and dried to form a conductive adhesive agent layer. In step 1, defining the average thickness of the conductive adhesive agent layer as T1 [μm] and the average particle diameter of the conductive particles as D1 [μm], the relation T1 < D1 is satisfied. Step 2: a step in which a second metal substrate is laminated on the conductive adhesive agent layer to obtain a connector that comprises the first metal substrate, the conductive adhesive agent layer and the second metal substrate in that order.
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Inventors:
SHIBATA DAISUKE (JP)
OWAKI MASAKI (JP)
MOCHIZUKI MASATAKA (JP)
MOROZUMI HIROSHI (JP)
OWAKI MASAKI (JP)
MOCHIZUKI MASATAKA (JP)
MOROZUMI HIROSHI (JP)
Application Number:
PCT/JP2022/029230
Publication Date:
February 09, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
PANAC CO LTD (JP)
International Classes:
H01B1/22; C09J9/02; C09J201/00; H01B5/14; H01B13/00; H01L21/60; H01R11/01; H01R43/00
Foreign References:
| JPH05187998A | 1993-07-27 | |||
| JPH01278338A | 1989-11-08 | |||
| JPH02297433A | 1990-12-07 | |||
| JP2017182709A | 2017-10-05 | |||
| JPH11157006A | 1999-06-15 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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