Title:
METHOD FOR PRODUCING COPPER CLAD LAMINATE, COPPER FOIL USED THEREIN, AND LAMINATING APPARATUS FOR COPPER CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2011/089930
Kind Code:
A1
Abstract:
Disclosed are: a method for producing a copper clad laminate that has both excellent flexibility and excellent productivity; a copper foil that is used in the method for producing a copper clad laminate; and a laminating apparatus for a copper clad laminate.
Specifically, before heating and laminating a copper foil and a resin layer by a laminating method, the copper foil is subjected to preheating wherein the copper foil is heated to a peak temperature of 220-280˚C within 3 seconds and held at the peak temperature for 1-5 seconds.
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Inventors:
NAKAMURO KAICHIRO (JP)
ONO TOSHIYUKI (JP)
ONO TOSHIYUKI (JP)
Application Number:
PCT/JP2011/050085
Publication Date:
July 28, 2011
Filing Date:
January 06, 2011
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
NAKAMURO KAICHIRO (JP)
ONO TOSHIYUKI (JP)
NAKAMURO KAICHIRO (JP)
ONO TOSHIYUKI (JP)
International Classes:
B29C65/64; B29C65/02; B32B15/08; H05K3/00; B21C37/02
Foreign References:
| JP2009292090A | 2009-12-17 | |||
| JP2000212661A | 2000-08-02 |
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
Ken-ichiro Akao (JP)
Ken-ichiro Akao (JP)
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Claims: