Title:
METHOD FOR PRODUCING COPPER POWDER, AND METHOD FOR PRODUCING CONDUCTIVE PASTE USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/057075
Kind Code:
A1
Abstract:
Provided is a method for producing a copper powder which is appropriately usable in, for example, a conductive paste and an electromagnetic wave shield, while ensuring an excellent conductivity achieved by increasing contact points among copper powder particles. The method according to the present invention for producing a copper powder comprises depositing a copper powder on a cathode from a liquid electrolyte by electrolysis, wherein: the copper powder is in a dendritic shape having a trunk and a plurality of branches branched from the trunk, and the trunk and branches are configured from plate-type copper particles having an average cross-sectional thickness of 0.02-5.0 µm; and the average particle size (D50) of the copper powder is 1.0-100 µm. In the production method using electrolysis, the liquid electrolyte contains copper ion together with 1-10,000 mg/L of one or more members selected from a compound having a specific phenazine structure, a compound having a specific azobenzene structure, and a compound having a specific phenazine structure and azobenzene structure.
Inventors:
YAMASHITA YU (JP)
OKADA HIROSHI (JP)
OKADA HIROSHI (JP)
Application Number:
PCT/JP2016/077534
Publication Date:
April 06, 2017
Filing Date:
September 16, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
C25C5/02; B22F1/00; B22F9/00; C25C1/12; H01B5/00; H01B13/00
Domestic Patent References:
| WO2015115139A1 | 2015-08-06 |
Foreign References:
| JP2011214032A | 2011-10-27 | |||
| JP5907302B1 | 2016-04-26 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
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