Title:
METHOD FOR PRODUCING CU-GA ALLOY POWDER, CU-GA ALLOY POWDER, METHOD FOR PRODUCING CU-GA ALLOY SPUTTERING TARGET, AND CU-GA ALLOY SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2011/126092
Kind Code:
A1
Abstract:
Disclosed are: a method for producing a Cu-Ga alloy powder, by which a high quality Cu-Ga alloy powder can be easily produced; a Cu-Ga alloy powder; a method for producing a Cu-Ga alloy sputtering target; and a Cu-Ga alloy sputtering target. Specifically, a Cu-Ga alloy powder is obtained by stirring and alloying a mixed powder, in which a Cu powder and Ga are blended at a mass ratio from 85:15 to 55:45, in an inert atmosphere at a temperature of 30-700˚C. A Cu-Ga alloy sputtering target is obtained by molding and sintering the Cu-Ga alloy powder.
Inventors:
MORIMOTO TOSHIO (JP)
TAKAHASHI TATSUYA (JP)
ANDO ISAO (JP)
KOMUKAI TETSUFUMI (JP)
TAKAGI MASANORI (JP)
SATO ERIKO (JP)
MINAMI HIROTAKA (JP)
TAKAHASHI TATSUYA (JP)
ANDO ISAO (JP)
KOMUKAI TETSUFUMI (JP)
TAKAGI MASANORI (JP)
SATO ERIKO (JP)
MINAMI HIROTAKA (JP)
Application Number:
PCT/JP2011/058846
Publication Date:
October 13, 2011
Filing Date:
April 07, 2011
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
MORIMOTO TOSHIO (JP)
TAKAHASHI TATSUYA (JP)
ANDO ISAO (JP)
KOMUKAI TETSUFUMI (JP)
TAKAGI MASANORI (JP)
SATO ERIKO (JP)
MINAMI HIROTAKA (JP)
MORIMOTO TOSHIO (JP)
TAKAHASHI TATSUYA (JP)
ANDO ISAO (JP)
KOMUKAI TETSUFUMI (JP)
TAKAGI MASANORI (JP)
SATO ERIKO (JP)
MINAMI HIROTAKA (JP)
International Classes:
B22F1/00; B22F3/14; C22C9/00; C23C14/34
Foreign References:
| JPS57107501A | 1982-07-05 | |||
| JPS61261456A | 1986-11-19 | |||
| JP2008138232A | 2008-06-19 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
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Claims: