Title:
METHOD FOR PRODUCING ELECTROCONDUCTIVE PARTICLES
Document Type and Number:
WIPO Patent Application WO/2003/014426
Kind Code:
A1
Abstract:
A method for producing electroconductive particles wherein a plating layer is formed on the surface of particles to be plated by the use of a barrel plating device which has a rotary barrel in the plating vessel thereof, characterized in that the particles to be plated and dummy particles having a diameter larger than that of the particles to be plated are charged into the barrel and the plating layer is formed while vibrating the barrel with an amplitude of 0.05 to 3.0 mm at a frequency of 20 to 120 Hz. The method allows the production of electroconductive particles having a plating layer which is of extremely uniform thickness and free of scratches, with no coagulation of particles to be plated during plating operation, and can be employed for producing electroconductive particles comprising resin particles and, formed on the surface thereof, a tin/silver alloy plating layer.
Inventors:
TANAKA YOSHIAKI (JP)
OKINAGA NOBUYUKI (JP)
MATSUBARA MANABU (JP)
OKINAGA NOBUYUKI (JP)
MATSUBARA MANABU (JP)
Application Number:
PCT/JP2002/007794
Publication Date:
February 20, 2003
Filing Date:
July 31, 2002
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
TANAKA YOSHIAKI (JP)
OKINAGA NOBUYUKI (JP)
MATSUBARA MANABU (JP)
TANAKA YOSHIAKI (JP)
OKINAGA NOBUYUKI (JP)
MATSUBARA MANABU (JP)
International Classes:
B22F1/18; C25D5/00; C25D7/00; C25D17/16; (IPC1-7): C25D17/16; C25D21/14
Domestic Patent References:
| WO1998046811A1 | 1998-10-22 |
Foreign References:
| JP2002121699A | 2002-04-26 | |||
| US5965820A | 1999-10-12 | |||
| US5167779A | 1992-12-01 | |||
| JPS55119197A | 1980-09-12 | |||
| JPH09137289A | 1997-05-27 | |||
| JPH1136099A | 1999-02-09 | |||
| JPH10331000A | 1998-12-15 | |||
| JP2001032097A | 2001-02-06 |
Attorney, Agent or Firm:
Yasutomi, Yasuo (4-20 Nishinakajima 5-chome, Yodogawa-k, Osaka-shi Osaka, JP)
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