Title:
METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/268555
Kind Code:
A3
Abstract:
The invention relates to a method for producing an electronic component, comprising the following steps: - providing a support (1) having a mounting surface (2) on which an electronic semiconductor chip (3) is arranged; - providing a connection element (7) having a first main surface (8); - applying a first frame-like metallisation (6) onto or over the support (1) and applying a first frame-like solder reservoir (10) over the first main surface (8) of the connection element (7) or applying the first frame-like metallisation (6) over the first main surface (8) of the connection element (7) and applying the first frame-like solder reservoir (10) over or onto the support (1), wherein a width (BL) of the first frame-like solder reservoir (10) is smaller than a width (BM) of the first frame-like metallisation (6); and - liquefying the solder of the first frame-like solder reservoir (10) such that a first frame-like solder layer (16) is formed that integrally bonds the support (1) and the connection element (7) together. The invention also relates to an electronic component.
Inventors:
RAMCHEN JOHANN (DE)
SORG JÖRG ERICH (DE)
MÜLLER KLAUS (DE)
MARFELD JAN (DE)
STRAUSS STEFFEN (DE)
WALTER JOHANN (DE)
SORG JÖRG ERICH (DE)
MÜLLER KLAUS (DE)
MARFELD JAN (DE)
STRAUSS STEFFEN (DE)
WALTER JOHANN (DE)
Application Number:
PCT/EP2022/066002
Publication Date:
February 16, 2023
Filing Date:
June 13, 2022
Export Citation:
Assignee:
OSRAM OPTO SEMICONDUCTORS GMBH (DE)
International Classes:
H01L21/50; H01L23/10; H01L33/48; H01L23/055
Foreign References:
| US5064782A | 1991-11-12 | |||
| US5786548A | 1998-07-28 |
Attorney, Agent or Firm:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH (DE)
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