METHOD FOR PRODUCING ELECTRONIC DEVICE

WIPO Patent Application WO/2021/199919

A1

A method for producing an electronic device, said method comprising at least: a preparation step for preparing a structure (100) which is provided with a base material layer (10), an adhesive film (50) that comprises an adhesive resin layer (A) which is provided on a first surface (10A) side of the base material layer (10) for the purpose of provisionally affixing an electronic component (70), an adhesive resin layer (B) which is provided on a second surface (10B) side of the base material layer (10), and a relief absorbing resin layer (C) which is provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B), while being able to be crosslinked by means of an external stimulus, and an electronic component (70) that is bonded to the adhesive resin layer (A) of the adhesive film (50), while having a relief structure (75); a crosslinking step for crosslinking the relief absorbing resin layer (C) in the structure (100) by applying an external stimulus to the relief absorbing resin layer (C); and a sealing step for sealing the electronic component (70) by means of a sealing material (60).

WO/1998/035377	METHOD AND APPARATUS FOR DISPENSING LIQUIDS
JP2641128	[Title of the Invention] A method for processing an electronic component with a laser.
JPH09260428	SEMICONDUCTOR DEVICE AN MOUNTING METHOD THEREOF

MIURA TORU (JP)
KURIHARA HIROYOSHI (JP)

PCT/JP2021/008786

October 07, 2021

March 05, 2021

Click for automatic bibliography generation  

MITSUI CHEMICALS TOHCELLO INC (JP)

H01L21/56

WO2019017226A1

2019-01-24

JP2013157470A	2013-08-15
JP2020061027A	2020-04-16

See also references of EP 4131348A4

HAYAMI Shinji (JP)

View/Download PDF      PDF Help

Previous Patent: DRIVE DEVICE, LIGHT-EMITTING DEVICE, AND DRIVE METHOD

Next Patent: IMPEDANCE MATCHING FILM AND RADIO WAVE ABSORBER