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Patent Searching and Data


Title:
METHOD FOR PRODUCING A FILLED RECESS IN A MATERIAL LAYER, INTEGRATED CIRCUIT PRODUCED USING SAID METHOD
Document Type and Number:
WIPO Patent Application WO2000003560
Kind Code:
A3
Abstract:
The recess is produced in a material layer (S) by creating at least a first (S1) and a second structure (S2) in various steps. Said layers define each other laterally and extend to the bottom of the recess. The first structure (S1) and the second structure (S2) are so narrow that they can be made by creating conformally produced layers (F1, F2) that have an independent thickness and are smaller than the depth of said recess. The conformally produced layers (F1, F2) are formed in an appropriate deposition process. A covering structure can be produced on top of the first (S1) and second structure (S2). An opening can be made in said covering structure, through which the first structure (S1) and the second structure (S2) can be removed in an etching step.

Inventors:
AIGNER ROBERT (DE)
OPPERMANN KLAUS-GUENTER (DE)
Application Number:
DE9902041W
Publication Date:
February 24, 2000
Filing Date:
July 02, 1999
Export Citation:
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Assignee:
SIEMENS AKTIENGESELLSCHAFT
AIGNER, ROBERT
OPPERMANN, KLAUS-GUENTER
International Classes:
G01P15/08; G01L9/00; H01L29/84; H04R19/00; H04R19/04; H04R31/00; (IPC1-7): H04R19/00; H01L21/762; H01L21/3105
Foreign References:
US5665622A1997-09-09
US5358891A1994-10-25
DE19636914A11998-03-12
EP0862207A11998-09-02
US4753901A1988-06-28
EP0340524A11989-11-08
US5324683A1994-06-28
Other References:
See also references of EP 1101389A2
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