METHOD FOR PRODUCING FILM FORMATION SUBSTRATE, FILM FORMATION SUBSTRATE, AND SURFACE TREATMENT AGENT

Title:

METHOD FOR PRODUCING FILM FORMATION SUBSTRATE, FILM FORMATION SUBSTRATE, AND SURFACE TREATMENT AGENT

Document Type and Number:

WIPO Patent Application WO/2019/082681

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing, inter alia, a method for producing a film formation substrate with which it is possible to adequately improve both bleeding of a resin composition and the adhesiveness between the resin composition and a metal substrate surface. A method for producing a film formation substrate in which a film of a resin composition is formed on a metal substrate surface, wherein the method for producing a film formation substrate is provided with an etching step for etching the metal substrate surface using a microetching agent, a surface treatment step for bringing a surface treatment agent into contact with the etched metal substrate surface and conducting surface treatment such that the contact angle of water on the surface is 50-150°, and a film formation step for forming a film of the resin composition by an ink jet method on the surface-treated metal substrate surface.

Inventors:

NISIE KENJI (JP)
OKA YUKI (JP)
ICHIHASHI TOMOKO (JP)
FUJII TAKUTO (JP)

Application Number:

PCT/JP2018/038011

Publication Date:

May 02, 2019

Filing Date:

October 11, 2018

Export Citation:

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Assignee:

MEC CO LTD (JP)

International Classes:

B05D3/10; B05D1/26; B05D7/14; C09D11/30; C23C22/26; C23C22/52; H05K3/06; H05K3/26

Domestic Patent References:

WO2016111035A1	2016-07-14
WO2016111035A1	2016-07-14
WO2016111036A1	2016-07-14

Foreign References:

JP2009532205A	2009-09-10
JPH0770767A	1995-03-14
JP2017034256A	2017-02-09
JP2015192963A	2015-11-05
JPH04506528A	1992-11-12
JP2015192963A	2015-11-05

Other References: