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Patent Searching and Data


Title:
METHOD FOR PRODUCING FILM, METHOD FOR PRODUCING LAMINATED BODY, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/038001
Kind Code:
A1
Abstract:
Provided are a method for producing a laminated body with excellent adhesion and a method for producing an electronic device. In implementing same, a resin composition layer is formed on a support a resin composition containing a polyimide precursor and a reactive group-containing silane coupling agent, and the resin composition layer is heated in a multi-stage heating process including at least two heating stages, wherein the second heating stage is performed at a heating temperature higher than a heating temperature in the first heating stage.

Inventors:
SAWANO Mitsuru (4000 Kawashiri Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
KAMOCHI Yoshitaka (4000 Kawashiri Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
INUJIMA Takayoshi (4000 Kawashiri Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
IWAI Yu (4000 Kawashiri Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
ITO Katsuyuki (4000 Kawashiri, Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
VANCLOOSTER Stefan (Keetberglaan 1A Havennummer 1061, Zwijndrecht, B-2070, BE)
Application Number:
JP2017/029573
Publication Date:
March 01, 2018
Filing Date:
August 18, 2017
Export Citation:
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Assignee:
FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
International Classes:
B05D7/24; B05D3/02; B32B27/34; G03F7/027; G03F7/037; G03F7/075
Attorney, Agent or Firm:
SIKS & CO. (8th Floor, Kyobashi-Nisshoku Bldg. 8-7, Kyobashi 1-chome, Chuo-k, Tokyo 31, 〒1040031, JP)
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