Title:
METHOD FOR PRODUCING FLEXIBLE PRINTED BOARD, AND FLEXIBLE PRINTED BOARD
Document Type and Number:
WIPO Patent Application WO/2018/131285
Kind Code:
A1
Abstract:
Provided is a method for producing a flexible printed board, which comprises a step for forming a via hole in a short time without any remaining smear. Specifically, a method for producing a flexible printed board according to the present invention comprises: a step for providing a first photosensitive insulating resin layer on one surface of a first conductive layer; a step for forming a first hole in the first photosensitive insulating resin layer by means of photolithography, said first hole reaching the first conductive layer; and a step for providing a first wiring layer on a surface of the first photosensitive insulating resin layer, said surface being on the reverse side of the surface that is in contact with the first conductive layer. In the step for providing the first wiring layer, the first wiring layer is electrically connected to the first conductive layer by means of a first conductive member that is provided within the first hole.
Inventors:
ARAKI KATSUFUMI (JP)
KANEKO MIHARU (JP)
UEHARA HIDEO (JP)
KANEKO MIHARU (JP)
UEHARA HIDEO (JP)
Application Number:
PCT/JP2017/041053
Publication Date:
July 19, 2018
Filing Date:
November 15, 2017
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H05K3/40; H05K1/11; H05K3/46
Domestic Patent References:
| WO2013145043A1 | 2013-10-03 |
Foreign References:
| JPH1131885A | 1999-02-02 | |||
| JPH11145621A | 1999-05-28 | |||
| JPH0964543A | 1997-03-07 | |||
| JPH1197847A | 1999-04-09 | |||
| JP2016133661A | 2016-07-25 | |||
| JPH04179297A | 1992-06-25 |
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