Title:
METHOD OF PRODUCING FORMED CIRCUIT COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/060115
Kind Code:
A1
Abstract:
An electroless plating layer with strong adhesion is optionally formed only on a portion to be a circuit, and other non-circuit portions are not roughened. A laser beam (2) with a wavelength of 405~1064nm is optionally irradiated onto the portion to be a circuit (11) of a synthetic resin substrate (1), and an ionic catalyst of palladium is caused to be adsorbed and then reduced to metallic palladium by a reducing agent. Subsequently, an electroless plating layer (3) is formed on the portion to be a circuit (11). Since the portion to be a circuit (11) is surface modified and roughened, the ionic catalyst firmly attaches, and the electroless plating layer (3) strongly adheres. The ionic catalyst does not adsorb onto the non-circuit portions (12) not irradiated by the laser beam (2), and thus the electroless plating layer (3) is not formed thereon.
Inventors:
YUMOTO TETSUO (JP)
WATANABE MITSUHIRO (JP)
SAITO YUICHI (JP)
WATANABE MITSUHIRO (JP)
SAITO YUICHI (JP)
Application Number:
PCT/JP2011/053789
Publication Date:
May 10, 2012
Filing Date:
February 22, 2011
Export Citation:
Assignee:
SANKYO KASEI KK (JP)
YUMOTO TETSUO (JP)
WATANABE MITSUHIRO (JP)
SAITO YUICHI (JP)
YUMOTO TETSUO (JP)
WATANABE MITSUHIRO (JP)
SAITO YUICHI (JP)
International Classes:
H05K3/18; C23C18/06; C23C18/16; C23C18/38; H05K1/03; H05K3/38
Foreign References:
| JP2008106345A | 2008-05-08 | |||
| JP2000212757A | 2000-08-02 | |||
| JP2004273707A | 2004-09-30 | |||
| JPH10335781A | 1998-12-18 | |||
| JPH07116870A | 1995-05-09 | |||
| JPH07212008A | 1995-08-11 |
Other References:
See also references of EP 2555601A4
Attorney, Agent or Firm:
SHIMOSAKA, Sumiko et al. (JP)
Sumi Shimosaka child (JP)
Sumi Shimosaka child (JP)
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Claims: