Title:
METHOD FOR PRODUCING FRP PRECURSOR, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/088477
Kind Code:
A1
Abstract:
The present invention provides a method for producing an FRP precursor according to which a resin film provided with a support is affixed to an aggregate, the support can be easily peeled from the resin film thereafter, and no resin components will adhere to the separated support side. The present invention further provides a method for producing a laminate involving the use of the FRP precursor obtained by the method for producing an FRP laminate, a method for producing a printed circuit board, and method for producing a semiconductor package. More specifically, the present invention provides a method for producing an FRP precursor according to which a resin film provided with a support is affixed to an aggregate, and the support is peeled from the resin film thereafter, wherein the resin film comprises a thermosetting resin composition containing a siloxane compound (a).
Inventors:
HASHIMOTO SHINTARO (JP)
NAKAMURA YUKIO (JP)
DANJOUBARA KAZUTOSHI (JP)
SAITOH TAKESHI (JP)
SASAKI RYOHTA (JP)
NAKAMURA YUKIO (JP)
DANJOUBARA KAZUTOSHI (JP)
SAITOH TAKESHI (JP)
SASAKI RYOHTA (JP)
Application Number:
PCT/JP2017/040437
Publication Date:
May 17, 2018
Filing Date:
November 09, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08J5/24; B32B5/28; H05K1/03
Domestic Patent References:
| WO2015033731A1 | 2015-03-12 |
Foreign References:
| JP2016060882A | 2016-04-25 | |||
| JP2016060780A | 2016-04-25 | |||
| JP2015005758A | 2015-01-08 | |||
| JP2015108073A | 2015-06-11 | |||
| JPH11268038A | 1999-10-05 | |||
| JPH0741575A | 1995-02-10 |
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (JP)
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