Title:
METHOD FOR PRODUCING GLASS MEMBER PROVIDED WITH SEALING MATERIAL LAYER, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/055888
Kind Code:
A1
Abstract:
Laser sealability of a glass panel and reliability thereof are increased by suppressing cracks, fractures, separation and the like of a glass substrate or a sealing material layer during laser sealing.
A first paste for sealing material containing no laser absorbent and a second paste for sealing material containing a laser absorbent are sequentially applied in this order to a sealing region (2a) of a glass substrate (2). A multilayer film composed of a coating layer (11) of the first paste for sealing material and a coating layer (12) of the second paste for sealing material is fired, thereby forming a sealing material layer (3) having a multilayer structure which is composed of a first sealing glass material layer (4) and a second sealing glass material layer (5). The second glass substrate (2) having the sealing material layer (3) is laminated on a glass substrate having a region for element formation, and then sealed thereto by irradiating the sealing material layer (3) with laser light from the first sealing glass material layer (4) side through the second glass substrate (2).
Inventors:
SHIBUYA KOICHI (JP)
IDE ASAHI (JP)
KAWANAMI SOHEI (JP)
IDE ASAHI (JP)
KAWANAMI SOHEI (JP)
Application Number:
PCT/JP2009/069289
Publication Date:
May 20, 2010
Filing Date:
November 12, 2009
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
SHIBUYA KOICHI (JP)
IDE ASAHI (JP)
KAWANAMI SOHEI (JP)
SHIBUYA KOICHI (JP)
IDE ASAHI (JP)
KAWANAMI SOHEI (JP)
International Classes:
C03C27/06; C03C17/34; H01L31/02; H01L51/50; H05B33/04
Foreign References:
JP2007200836A | 2007-08-09 | |||
JP2006524419A | 2006-10-26 | |||
JP2008115057A | 2008-05-22 | |||
JP2001092376A | 2001-04-06 | |||
JP2006524419A | 2006-10-26 | |||
JP2008115057A | 2008-05-22 | |||
JP2007200836A | 2007-08-09 | |||
JP2008291967A | 2008-12-04 |
Other References:
See also references of EP 2348002A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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