Title:
METHOD FOR PRODUCING GLASS SUBSTRATE, AND GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2013/129165
Kind Code:
A1
Abstract:
This method for producing a glass substrate having a through hole comprises: (a) a step of preparing a glass substrate in which the average thermal expansion coefficient in a range of from 50°C to 300°C is within the range of from 55×10-7/K to 120×10-7/K and the thickness is from 0.2 mm to 1 mm inclusive; and (b) a step of forming a through hole in said glass substrate by using a laser-induced discharge technique.
Inventors:
TAKAHASHI SHINTARO (JP)
DITTMANN LEANDER (CH)
CHAIZE ADRIEN (CH)
DITTMANN LEANDER (CH)
CHAIZE ADRIEN (CH)
Application Number:
PCT/JP2013/053891
Publication Date:
September 06, 2013
Filing Date:
February 18, 2013
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03B33/08; B23H9/14; B23K26/38; B23K26/40; B26F1/28; B26F1/31
Foreign References:
| JPH09255351A | 1997-09-30 | |||
| JP2003003043A | 2003-01-08 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
Tadashige Ito (JP)
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Claims: