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Title:
METHOD FOR PRODUCING HEAT-CONDUCTIVE SHEET, HEAT-CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/104169
Kind Code:
A1
Abstract:
A method for producing a heat-conducive sheet, comprising: a molded article production step of molding a heat-conductive resin composition comprising a binder resin and a heat-conductive filler into a desired shape and then curing the molded product to produce a molded article made from the heat-conductive resin composition; a molded article sheet production step of cutting the molded article into a sheet-like shape to produce a molded article sheet in which the heat-conducive filler is protruded on the surface of the sheet; and a pressing step of pressing the molded article sheet so that the surface of the molded article sheet is coated with an oozed component that is oozed from the molded article sheet in such a manner that the oozed component can follow the protruded shape formed by the protruded heat-conductive filler on the surface of the molded article sheet.

Inventors:
ARAMAKI KEISUKE (JP)
SUGAWARA MASAKO (JP)
UCHIDA SYUNSUKE (JP)
Application Number:
PCT/JP2015/084665
Publication Date:
June 30, 2016
Filing Date:
December 10, 2015
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/36; B29C43/02; C08J5/18; H05K7/20
Foreign References:
JP2012038763A2012-02-23
JP2011074303A2011-04-14
JP2012001638A2012-01-05
JP2009215404A2009-09-24
JP5752299B22015-07-22
JP5766335B22015-08-19
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
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