METHOD FOR PRODUCING HEAT DISSIPATION STRUCTURE

WIPO Patent Application WO/2018/056205

A1

Provided is a method for producing a heat dissipation structure (150) including an adherend (145) and a heat dissipation sheet (148) bonded to the adherend (145), the heat dissipation sheet (148) being made of a cured product of a resin composition including a thermosetting resin and a heat-conducting filler. The method includes a step for preparing the adherend (145), a step for molding the resin composition into a sheet to obtain a resin sheet, a step for heating the resin sheet to a temperature equal to or higher than the softening point of the resin sheet to obtain a resin sheet in a softened state, a step for cooling the resin sheet to a temperature lower than the softening point of the resin sheet while pressurizing the resin sheet at a first pressure P1 in a state where the resin sheet in the softened state is in contact with the adherend (145), and a step for performing heat treatment while pressurizing the resin sheet at a second pressure P2 to cure the resin sheet and obtain the heat dissipation sheet (185) bonded to the adherend. The first pressure P1 is equal to or higher than the second pressure P2.

YAGISAWA TAKASHI (JP)
OKADA WATARU (JP)
TSUDA MIKA (JP)
SATO TOSHIHIRO (JP)
HATANO HARUYUKI (JP)

PCT/JP2017/033437

March 29, 2018

September 15, 2017

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SUMITOMO BAKELITE CO (JP)

H01L23/36

WO2013099545A1	2013-07-04
WO2016125419A1	2016-08-11

JP2016103527A	2016-06-02
JP2013065648A	2013-04-11
JP2014099505A	2014-05-29
JP2015035568A	2015-02-19
JP2016111089A	2016-06-20
JP2010267663A	2010-11-25
JP2011116913A	2011-06-16

HAYAMI Shinji (JP)

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