Title:
METHOD OF PRODUCING HEAT PIPE-TYPE SEMICONDUCTOR COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/1990/009036
Kind Code:
A1
Abstract:
A method of producing a heat pipe-type semiconductor cooling device wherein one or a plurality of through holes are provided in a long metallic member, which is then cut into a predetermined length to obtain predetermined metallic blocks. The ends of the through holes of the metallic blocks are sealed and the heat-absorbing portion is constituted of the heat-junction and then one end of a heat pipe is fitted thereto. Or the end of the heat pipe is fitted to the through hole, the end of the through hole is sealed, and they are heat-joined to constitute the heat-absorbing portion. Then, a fin is forced into the other end of the heat pipe to constitute the heat-radiating portion.
Inventors:
MURASE TAKASHI (JP)
Application Number:
PCT/JP1990/000145
Publication Date:
August 09, 1990
Filing Date:
February 06, 1990
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
F28D15/02; H01L23/427; (IPC1-7): H01L23/427
Foreign References:
| JPS5941858A | 1984-03-08 | |||
| JPS6057956A | 1985-04-03 | |||
| JPS61138092A | 1986-06-25 | |||
| JPS5971072U | 1984-05-14 |
Other References:
See also references of EP 0539583A4
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