Title:
METHOD FOR PRODUCING HEAT-SHIELDING PLY STRUCTURE, HEAT-SHIELDING PLY STRUCTURE, AND TRANSPARENT LAMINATE FILM FOR PLY STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2012/111367
Kind Code:
A1
Abstract:
Provided is a method for producing a heat-shielding ply structure having superior solar radiation shielding performance and superior radio wave transmittance. At least one side of a transparent polymer film has a laminate structure part formed by laminating a metal layer and a metal oxide layer containing an organic component. A transparent laminate film (12), on which a groove having a width of 30 μm or smaller is formed for dividing the metal layer on the laminate structure part, is interposed between two transparent substrates (14, 14). Pressure is applied to bond the two transparent substrates (14, 14) with the transparent laminate film (12) interposed therebetween. The pressure also causes fragmentation of the metal layer of the transparent laminate film (12), and increases the surface resistance value overall.
Inventors:
INAGAKI HIROKI (JP)
TAKEUCHI TETSUYA (JP)
NARASAKI TETSUJI (JP)
INUZUKA MASATAKA (JP)
GOTO OSAMU (JP)
TAKEUCHI TETSUYA (JP)
NARASAKI TETSUJI (JP)
INUZUKA MASATAKA (JP)
GOTO OSAMU (JP)
Application Number:
PCT/JP2012/050580
Publication Date:
August 23, 2012
Filing Date:
January 13, 2012
Export Citation:
Assignee:
TOKAI RUBBER IND LTD (JP)
INAGAKI HIROKI (JP)
TAKEUCHI TETSUYA (JP)
NARASAKI TETSUJI (JP)
INUZUKA MASATAKA (JP)
GOTO OSAMU (JP)
INAGAKI HIROKI (JP)
TAKEUCHI TETSUYA (JP)
NARASAKI TETSUJI (JP)
INUZUKA MASATAKA (JP)
GOTO OSAMU (JP)
International Classes:
B32B9/00; B32B3/10; B32B15/08; C03C27/12
Domestic Patent References:
WO2011024756A1 | 2011-03-03 |
Foreign References:
JP2010202497A | 2010-09-16 | |||
JP2001026071A | 2001-01-30 | |||
JPH0570178A | 1993-03-23 | |||
JPH07242441A | 1995-09-19 | |||
JP2005353656A | 2005-12-22 | |||
JP8028592B | ||||
JP2005104793A | 2005-04-21 |
Other References:
See also references of EP 2535180A4
Attorney, Agent or Firm:
UENO, NOBORU (JP)
Ueno 登 (JP)
Ueno 登 (JP)
Download PDF:
Claims:
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