METHOD FOR PRODUCING HOLLOW PACKAGE AND METHOD FOR PROVIDING PHOTOSENSITIVE COMPOSITION

Title:

METHOD FOR PRODUCING HOLLOW PACKAGE AND METHOD FOR PROVIDING PHOTOSENSITIVE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2022/107840

Kind Code:

A1

Abstract:

This method for producing a hollow package includes: a step for forming a side wall on a substrate having aluminum wiring; and a step for forming a top plate portion on the side wall to produce a hollow structure that houses the aluminum wiring. A photosensitive composition that forms the side wall and/or the top plate portion contains an anion represented by general formula (I1-an). (In general formula (I1-an), A is a heteroatom; X is a halogen atom; R is a monovalent organic group; k is an integer between 1 and 6; m is 0 to 5; n is an integer between 1 and 3; and the value of m/(k+m) is not less than 0 and less than 0.7.)

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Inventors:

YAMAGATA KENICHI (JP)
KONDO TAKAHIRO (JP)
TAKEUCHI HIROAKI (JP)
IMAI HIROFUMI (JP)

Application Number:

PCT/JP2021/042389

Publication Date:

May 27, 2022

Filing Date:

November 18, 2021

Export Citation:

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Assignee:

TOKYO OHKA KOGYO CO LTD (JP)

International Classes:

C07F5/02; C07F9/52; G03F7/004; G03F7/038; H01L23/08; H03H3/08; H03H9/25

Domestic Patent References:

WO2013018635A1	2013-02-07
WO2018194154A1	2018-10-25

Foreign References:

JP2018013807A

2018-01-25

Attorney, Agent or Firm:

TAZAKI Akira et al. (JP)

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