Title:
METHOD FOR PRODUCING HOLLOW STRUCTURE, PLATED COMPOSITE AND HOLLOW STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/154802
Kind Code:
A1
Abstract:
Provided are: a method for producing a hollow structure that is useful as a base material for a heat sink, etc. which increases heat dissipation of devices installed in various kinds of electronic equipment without sacrificing size reduction, thickness reduction, weight reduction and multifunctionality thereof; and a hollow structure. A hollow structure 5, comprising a skeleton 5B that encompasses the entirety of copper plating layers 3a, 3b and 3c, is produced by: covering the surface of an aluminum sheet and forming a copper plating layer 3 to produce a plated composite; cutting portions out of the plated composite to reveal cut surfaces of the aluminum sheet; and then immersing said plated composite in an aqueous sodium solution that dissolves aluminum but does not dissolve copper to selectively dissolve and remove only the aluminum and make certain sites of the aluminum sheet into hollow parts 5A.
Inventors:
MIZOGUCHI MASANORI (JP)
Application Number:
PCT/JP2017/021876
Publication Date:
August 30, 2018
Filing Date:
June 13, 2017
Export Citation:
Assignee:
ASAHI DENKA KENKYUSHO CO LTD (JP)
International Classes:
C25D1/02; C23C18/38; C23F1/00
Foreign References:
| JPS4953540A | 1974-05-24 | |||
| JPH06179983A | 1994-06-28 | |||
| JPH09505388A | 1997-05-27 |
Attorney, Agent or Firm:
MUGISHIMA Takashi (JP)
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