Title:
METHOD FOR PRODUCING JOINING STRUCTURE, AND JOINING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/143521
Kind Code:
A1
Abstract:
A method involving a perforation step for preparing a laser-beam source capable of repeatedly oscillating a laser pulse group at a constant period, and by using the laser-beam source, forming a plurality of perforations (4) in the surface section of a metal member (2) constituting a joining surface to be joined to a resin member (3), and a joining step for joining the metal member (2) and the resin member (3) to one another by filling the plurality of perforations (4) with the resin member (3), wherein the laser pulse group is configured by combining a plurality of sub-pulse trains, the sub-pulse peak output of which differs from one another, in the time axis direction. As a result, it is possible to control the shape of the perforations (4) formed by the laser beam by efficiently using limited laser energy.
Inventors:
TOGAWA TAKUYA (JP)
Application Number:
PCT/JP2016/055468
Publication Date:
September 15, 2016
Filing Date:
February 24, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B23K26/324; B23K26/0622; B23K26/384; B29C65/16
Foreign References:
| JP2013529137A | 2013-07-18 | |||
| JP2006015405A | 2006-01-19 | |||
| JP2010274279A | 2010-12-09 | |||
| EP2251133A1 | 2010-11-17 |
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
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