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Patent Searching and Data


Title:
METHOD FOR PRODUCING JUNCTION STRUCTURE, AND JUNCTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/117504
Kind Code:
A1
Abstract:
The present invention is a method for producing a junction structure in which a first resin member and a second resin member that allow transmittance of a laser are joined together, the method comprising: a step in which, on the surface of the first resin member, formed is a mixed layer in which the first resin member and a metal are mixed and which has absorption properties with respect to a laser; a step in which the mixed layer and the second resin member are arranged adjacent to one another; and a step in which the mixed layer is irradiated with a laser, thereby joining the mixed layer and the second resin member together.

Inventors:
SATO DAISUKE (JP)
NISHIKAWA KAZUYOSHI (JP)
SUMIYA AKIO (JP)
HIRONO SATOSHI (JP)
Application Number:
PCT/JP2016/051278
Publication Date:
July 28, 2016
Filing Date:
January 18, 2016
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B29C65/16
Domestic Patent References:
WO2014007382A12014-01-09
Foreign References:
JP2005081771A2005-03-31
JP2008023911A2008-02-07
JPS6364729A1988-03-23
JP2015160334A2015-09-07
JP2011143653A2011-07-28
JP2003136600A2003-05-14
JP2004202498A2004-07-22
JP2008031393A2008-02-14
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
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