Title:
METHOD FOR PRODUCING LEAD WIRE TERMINAL, CHIP ELECTROLYTIC CAPACITOR, AND HALF-FINISHED PRODUCT OF LEAD WIRE TERMINAL
Document Type and Number:
WIPO Patent Application WO/2018/066681
Kind Code:
A1
Abstract:
The present invention suppresses local decrease of the solder wettability in a lead part of a lead wire terminal for chip electrolytic capacitors, while suppressing the generation of a metal powder. A method for producing a lead wire terminal 4 which has a band-like lead part 41 and a terminal part 42 that is provided at one end of the lead part 41, and which is fitted to a capacitor element 3 of a chip electrolytic capacitor 1 via the terminal part. This method for producing a lead wire terminal 4 comprises: a step for preparing a metal wire rod 411 which has a polygonal cross-sectional shape and is provided with a coating layer 412 having good solder wettability on the outer circumference; and a step for forming the lead part 41 by pressing the metal wire rod 411.
Inventors:
YAMAZAKI MANABU (JP)
Application Number:
PCT/JP2017/036402
Publication Date:
April 12, 2018
Filing Date:
October 02, 2017
Export Citation:
Assignee:
KOHOKU KOGYO KK (JP)
International Classes:
H01G9/008; H01G9/04; H01G13/00
Foreign References:
| JPH1126327A | 1999-01-29 | |||
| JP2004192929A | 2004-07-08 | |||
| JP2011054603A | 2011-03-17 | |||
| JPH0677374A | 1994-03-18 |
Download PDF: