Title:
METHOD OF PRODUCING METAL FILM
Document Type and Number:
WIPO Patent Application WO/2003/058696
Kind Code:
A1
Abstract:
A current concentration caused by an additive (especially, a brightener) remaining/depositing at a high density at a grain boundary triple-point and in a wiring groove portion in a copper-plating film surface layer is eliminated to restrict a lead elution and an abnormal elution, thereby obtaining the electropolished surface of a copper-plating film excellent in surface smoothness. A method of producing a metal film comprising the step of using a plating solution added with a plating additive for restricting void generation, bottom-up fill and over-fill to form a metal plating film (copper plating film (15)), and the step of using an electropolishing solution added with a polishing additive that reacts/bonds with a plating additive component contained in or deposited on a metal plating film surface layer to electropolish a metal plating film.
Inventors:
SATO SHUZO (JP)
NOGAMI TAKESHI (JP)
SEGAWA YUJI (JP)
NOGAMI TAKESHI (JP)
SEGAWA YUJI (JP)
Application Number:
PCT/JP2002/013837
Publication Date:
July 17, 2003
Filing Date:
December 27, 2002
Export Citation:
Assignee:
SONY CORP (JP)
SATO SHUZO (JP)
NOGAMI TAKESHI (JP)
SEGAWA YUJI (JP)
SATO SHUZO (JP)
NOGAMI TAKESHI (JP)
SEGAWA YUJI (JP)
International Classes:
C25D5/48; C25D7/12; C25F3/22; H01L21/28; H01L21/288; H01L21/3205; H01L21/768; H01L23/52; (IPC1-7): H01L21/288; C25D5/48; C25D7/12; C25F3/22; H01L21/28; H01L21/3205; H01L21/768
Foreign References:
| JP2002121698A | 2002-04-26 | |||
| JP2002222776A | 2002-08-09 | |||
| JP2000064083A | 2000-02-29 |
Attorney, Agent or Firm:
Nakamura, Tomoyuki c/o Miyoshi International Patent Office (9th Floor Toranomon Daiichi Building, 2-3,
Toranomon 1-chom, Minato-ku Tokyo, JP)
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