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Patent Searching and Data


Title:
METHOD FOR PRODUCING METAL LAMINATE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/152040
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for producing a metal laminate material with higher production efficiency while maintaining sufficient bonding strength. Disclosed is a method for producing a metal laminate material by bonding two plates respectively made of materials M1 and M2, wherein: each of M1 and M2 is a metal or an alloy including at least one type of element selected from the group consisting of Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb, and Bi; the method comprises a step for subjecting the surfaces to be bonded of the two plates to a sputtering treatment by inert gas ions in a vacuum such that an oxide film on the surface layer remains, a step for temporarily bonding the two plates by roll bonding, and a step for bonding the two plates by heating; and, if the melting point of M1 is Tm1 (K), the melting point of M2 is Tm2 (K), and Tm1 > Tm2, the temperature of the heat treatment is higher than or equal to 0.45Tm2 and lower than 0.45Tm1 (and does not exceed Tm2).

Inventors:
NANBU KOUJI (JP)
KUROKAWA TEPPEI (JP)
KOSHIRO TAKASHI (JP)
OKAYAMA HIRONAO (JP)
Application Number:
PCT/JP2015/059593
Publication Date:
October 08, 2015
Filing Date:
March 27, 2015
Export Citation:
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Assignee:
TOYO KOHAN CO LTD (JP)
International Classes:
B23K20/00; B32B15/01
Foreign References:
JP2004306458A2004-11-04
JP2005074913A2005-03-24
JP2006159797A2006-06-22
JPH02133563A1990-05-22
JPH0970918A1997-03-18
US4815652A1989-03-28
Other References:
See also references of EP 3127647A4
Attorney, Agent or Firm:
HIRAKI Yusuke et al. (JP)
Yusuke Hiraki (JP)
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