Title:
METHOD FOR PRODUCING METAL LAMINATED SUBSTRATE FOR OXIDE SUPERCONDUCTING WIRE, AND OXIDE SUPERCONDUCTING WIRE USING THE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2010/055651
Kind Code:
A1
Abstract:
A metal laminated substrate for an oxide superconducting wire is provided at low cost. The metal laminated substrate has high strength, and stable high biaxial orientation in the longitudinal direction.
A non-magnetic metal sheet (T1) having a thickness of 0.2 mm or less, and a metal foil (T2) which is composed of a Cu alloy cold-rolled at a draft of not less than 90% and having a thickness of 50 μm or less, are laminated together by surface activated bonding at room temperature; and then after providing the metal foil with a crystal orientation by a heat treatment at not less than 150˚C but not more than 1000˚C, an Ni or Ni alloy epitaxial growth film (T3) having a thickness of 10 μm or less is formed on the metal foil, thereby producing a metal laminated substrate for an oxide superconducting wire.
Inventors:
OKAYAMA, Hironao (Technical Research Laboratory, 1296-1, Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
岡山浩直 (〒11 山口県下松市東豊井１２９６番地の１ 東洋鋼鈑株式会社 技術研究所内 Yamaguchi, 〒7448611, JP)
KANEKO, Akira (Kudamatsu Plant, 1302, Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
金子彰 (〒11 山口県下松市東豊井１３０２番地 東洋鋼鈑株式会社 下松工場内 Yamaguchi, 〒7448611, JP)
岡山浩直 (〒11 山口県下松市東豊井１２９６番地の１ 東洋鋼鈑株式会社 技術研究所内 Yamaguchi, 〒7448611, JP)
KANEKO, Akira (Kudamatsu Plant, 1302, Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
金子彰 (〒11 山口県下松市東豊井１３０２番地 東洋鋼鈑株式会社 下松工場内 Yamaguchi, 〒7448611, JP)
Application Number:
JP2009/006018
Publication Date:
May 20, 2010
Filing Date:
November 11, 2009
Export Citation:
Assignee:
TOYO KOHAN CO., LTD. (2-12, Yonbancho Chiyoda-k, Tokyo 47, 〒1028447, JP)
東洋鋼鈑株式会社 (〒47 東京都千代田区四番町２番地１２ Tokyo, 〒1028447, JP)
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友電気工業株式会社 (〒41 大阪府大阪市中央区北浜４丁目５－３３ Osaka, 〒5410041, JP)
OKAYAMA, Hironao (Technical Research Laboratory, 1296-1, Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
岡山浩直 (〒11 山口県下松市東豊井１２９６番地の１ 東洋鋼鈑株式会社 技術研究所内 Yamaguchi, 〒7448611, JP)
東洋鋼鈑株式会社 (〒47 東京都千代田区四番町２番地１２ Tokyo, 〒1028447, JP)
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友電気工業株式会社 (〒41 大阪府大阪市中央区北浜４丁目５－３３ Osaka, 〒5410041, JP)
OKAYAMA, Hironao (Technical Research Laboratory, 1296-1, Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
岡山浩直 (〒11 山口県下松市東豊井１２９６番地の１ 東洋鋼鈑株式会社 技術研究所内 Yamaguchi, 〒7448611, JP)
International Classes:
H01B12/06; H01B13/00
Attorney, Agent or Firm:
OHTA PATENT OFFICE (New State Manor 356, 23-1 Yoyogi 2-chome, Shibuya-k, Tokyo 53, 〒1510053, JP)
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