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Title:
METHOD FOR PRODUCING MOLD RELEASE FILM FOR RESIN SHEET MOLDING
Document Type and Number:
WIPO Patent Application WO/2022/138485
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a mold release film that has a mold release layer having particularly excellent smoothness and releasability.　Provided is a method for producing a mold release film for resin sheet molding, the method including the following steps: a coating step for coating a mold release layer formation composition onto a surface layer A of a polyester film having said surface layer A, the surface layer A containing substantially no inorganic particles and the mold release layer formation composition including at least cation-curable polydimethylsiloxane (a); a drying step for heat-drying the polyester film coated with the mold release layer formation composition, the heat-drying including a first drying step followed by a second drying step and the drying temperature T1 during the first drying step being higher than the drying temperature T2 during the second drying step; and, after the drying step, a photocuring step for radiating active energy rays and curing the mold release layer formation composition.

Inventors:
SHIGENO KENTO (JP)
SHIBATA YUSUKE (JP)
KUSUBA HIROAKI (JP)
NAKATANI MITSUHARU (JP)
Application Number:
PCT/JP2021/046721
Publication Date:
June 30, 2022
Filing Date:
December 17, 2021
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
B05D3/06; B05D5/00; B05D7/04; B05D7/24; C09D183/04
Domestic Patent References:
WO2018159247A12018-09-07
WO2020050081A12020-03-12
Foreign References:
JP2018143901A2018-09-20
JP2018144500A2018-09-20
JPH11156825A1999-06-15
JP2010260315A2010-11-18
JP2020153022A2020-09-24
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