Title:
METHOD FOR PRODUCING MULTILAYER BODY, AND MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2023/276638
Kind Code:
A1
Abstract:
A method for producing a multilayer body that comprises two silicon substrates, the method comprising a novel process for bonding the two silicon substrates. A method for producing a multilayer body that comprises two silicon substrates, the method comprising: (a) a step for preparing a first silicon substrate that has a first bonding part and a second silicon substrate that has a second bonding part, the first bonding part and the second bonding part being portions that contain a silicon oxide; and (b) a step for bonding the first bonding part and the second bonding part to each other by means of a reaction product derived from an organic material that is reactive with a hydrosilyl group and/or a silanol group.
Inventors:
NAMIKAWA TAKASHI (JP)
NAKAGAWA CHIHIRO (JP)
MATSUNAGA TAKAYUKI (JP)
NAKAGAWA CHIHIRO (JP)
MATSUNAGA TAKAYUKI (JP)
Application Number:
PCT/JP2022/023647
Publication Date:
January 05, 2023
Filing Date:
June 13, 2022
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
H01L21/02; B32B7/12; B32B9/00; B32B37/12; B32B37/14; C09J11/06; C09J183/04; C09J201/00
Domestic Patent References:
| WO2020100965A1 | 2020-05-22 | |||
| WO2015072418A1 | 2015-05-21 | |||
| WO2016204114A1 | 2016-12-22 |
Foreign References:
| JPH0246722A | 1990-02-16 | |||
| JP2005347302A | 2005-12-15 | |||
| JP2020036039A | 2020-03-05 | |||
| JP2013082834A | 2013-05-09 | |||
| JP2012069783A | 2012-04-05 | |||
| JP2007184546A | 2007-07-19 | |||
| JP2021108617A | 2021-08-02 | |||
| JP2021168166A | 2021-10-21 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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