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Patent Searching and Data


Title:
METHOD FOR PRODUCING MULTILAYER METASURFACE STRUCTURE, AND MULTILAYER METASURFACE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/070650
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a production method that makes it possible to produce a multilayer metasurface structure with excellent position precision between metasurface structures. A production method according to the present invention comprises: a step 1 for disposing a spacer part including a polymerizable compound in a pattern on a first metasurface structure which includes a first substrate and a first structure layer that is provided to at least one surface side of the first substrate and that is obtained by disposing a plurality of first metallic microstructures in the in-plane direction; a step 2 for affixing, to the spacer part, a second metasurface structure which includes a second substrate and a second structure layer that is provided to at least one surface side of the second substrate and that is obtained by disposing a plurality of second metallic microstructures in the in-plane direction, so as to obtain a laminate including the first metasurface structure, the spacer part, and the second metasurface structure; and a step 3 for polymerizing the polymerizable compound.

Inventors:
KANNA SHINICHI (JP)
YOSHIHIRO TATSUYA (JP)
MOROZUMI KAZUMASA (JP)
Application Number:
PCT/JP2023/033137
Publication Date:
April 04, 2024
Filing Date:
September 12, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01P11/00; G02B3/00; G02B5/00; G02B5/18; H01P1/00; H01Q15/10; H05K1/03
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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