Title:
METHOD FOR PRODUCING MULTILAYER SUBSTRATE WITH BUILT-IN COMPONENT, AND MULTILAYER SUBSTRATE WITH BUILT-IN COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/185438
Kind Code:
A1
Abstract:
The production method of the present invention is a method for producing a multilayer substrate with a built-in component, which has a component (12) built in a resin multilayer substrate (11) that is formed by laminating and pressing thermoplastic resin sheets (111a-111d) for compression bonding. In this production method, metal patterns (13) are provided on a component mounting surface of the thermoplastic resin sheet (111a). In addition, the component (12) is inserted into a region that is sandwiched between the metal patterns (13). If a width (W2) is the component mounting surface-side width and a width (W3) is the component insertion-side width of the region that is sandwiched between the metal patterns (13), the width (W2) is not less than the width (W1) of the component but less than the width (W3).
Inventors:
YOSUI KUNIAKI (JP)
Application Number:
PCT/JP2014/062772
Publication Date:
November 20, 2014
Filing Date:
May 14, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2007043714A1 | 2007-04-19 | |||
| WO2012157426A1 | 2012-11-22 | |||
| WO2008136251A1 | 2008-11-13 |
Foreign References:
| JP2008270778A | 2008-11-06 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Download PDF: