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Title:
METHOD FOR PRODUCING NON-MAGNETIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2015/046525
Kind Code:
A1
Abstract:
Provided is a method for producing non-magnetic substrate and containing an end-surface polishing process for polishing the end surface of a plate-shaped non-magnetic substrate having a chamfered surface formed between a lateral wall surface and a primary surface, and a lateral wall surface. The end-surface polishing process is a process in which a magnetic field is formed using a magnetic field formation means in a manner so that the lines of magnetic force proceed in the thickness direction of the substrate, a lateral surface of the substrate and a magnetic functional fluid containing polishing grit are contacted together in the state of the magnetic functional fluid being held in the magnetic field, and the substrate and the magnetic functional fluid are moved relative to each other, thereby polishing the end surface of the substrate. During the end-surface polishing process, polishing grit is supplied to the magnetic functional fluid.

Inventors:
AZUMA SHUHEI (JP)
ONISHI MASARU (JP)
KOSHIMIZU OSAMU (JP)
Application Number:
PCT/JP2014/075929
Publication Date:
April 02, 2015
Filing Date:
September 29, 2014
Export Citation:
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Assignee:
HOYA CORP (JP)
International Classes:
B24B37/00; B24B1/00; B24B9/00; G11B5/84
Foreign References:
JP2007296598A2007-11-15
JP2008254140A2008-10-23
JPS6239172A1987-02-20
JP2010082746A2010-04-15
JP2005050501A2005-02-24
JPS6278259U1987-05-19
Attorney, Agent or Firm:
GLOBAL IP TOKYO (JP)
Global IP Tokyo patent business corporation (JP)
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