Title:
METHOD FOR PRODUCING OPTICAL MULTILAYER BODY, AND OPTICAL MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2022/270556
Kind Code:
A1
Abstract:
This method for producing an optical multilayer body comprises: a step A for preparing a first optical sheet that has a first main surface having a relief structure; a step B for preparing an adhesive layer; and a step C for bonding the adhesive layer to the first main surface of the first optical sheet. The relief structure comprises a plurality of recessed portions and a flat portion that is positioned between adjacent recessed portions. Each one of the plurality of recessed portions has an inclined surface that has an inclination angle θa. The stress Sp is obtained by dividing the 180° peel strength of the adhesive layer with respect to the first main surface of the first optical sheet by the film cross-sectional area, the 180° peel strength being determined by 180° peel test. P1 is the pressure at the time when the adhesive layer is bonded to the first main surface of the first optical sheet in step C. Pf is the pressure that is applied to the flat portion at the time when the adhesive layer is bonded to the first main surface of the first optical sheet in step C. If Dd is the value obtained by multiplying the strain corresponding to Pf in the compressive stress-strain curve of the adhesive layer by the thickness Dt of the adhesive layer in cases where (Sp × sinθa) ≥ Pf, and Dd is the value obtained by multiplying the strain corresponding to (Sp × sinθa) in the compressive stress-strain curve of the adhesive layer by the thickness Dt of the adhesive layer in cases where (Sp × sinθa) < Pf, Dd is 1.3 µm or less.
Inventors:
WAKAYAMA SHUNYA (JP)
KIRIBE SHIGEYOSHI (JP)
KIRIBE SHIGEYOSHI (JP)
Application Number:
PCT/JP2022/024974
Publication Date:
December 29, 2022
Filing Date:
June 22, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J11/06; B32B3/26; B32B3/30; C09J7/38; C09J133/14; C09J167/02; C09J201/00; G02B5/00; G02B5/02; G02B7/00
Domestic Patent References:
| WO2018174198A1 | 2018-09-27 | |||
| WO2021167090A1 | 2021-08-26 | |||
| WO2021167091A1 | 2021-08-26 |
Foreign References:
| JP2019178283A | 2019-10-17 | |||
| JP2009122160A | 2009-06-04 | |||
| JP2011026361A | 2011-02-10 | |||
| JP2017061676A | 2017-03-30 | |||
| JP2019059892A | 2019-04-18 | |||
| JP2010049820A | 2010-03-04 |
Attorney, Agent or Firm:
OKUDA Seiji (JP)
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