Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR PRODUCING PACKAGE STRUCTURE AND SHEET USED IN SAME
Document Type and Number:
WIPO Patent Application WO/2019/088128
Kind Code:
A1
Abstract:
A method for producing a package structure, which comprises: a step for preparing a package member which is provided with a first circuit member and a plurality of second circuit members that are mounted on the first circuit member, with bumps being interposed therebetween, and which is provided with a space between the first circuit member and the second circuit members; a step for preparing a sheet which is provided with a space retention layer; an arrangement step for arranging the sheet in the package member so that the space retention layer faces the second circuit members; and a sealing step wherein the sheet is pressed against the first circuit member, while being heated, so that the second circuit members are sealed, while maintaining the space, and the sheet is cured. The bumps are solder bumps; the glass transition temperature of the space retention layer after curing is higher than 125°C; and the linear expansion coefficient for the range of 125°C or less is 20 ppm/K or less.

Inventors:
HASHIMOTO Takayuki (236 Nakai, Tatsuno-cho, Tatsuno-sh, Hyogo 24, 〒6794124, JP)
ISHIBASHI Takuya (236 Nakai, Tatsuno-cho, Tatsuno-sh, Hyogo 24, 〒6794124, JP)
NISHIMURA Kazuki (236 Nakai, Tatsuno-cho, Tatsuno-sh, Hyogo 24, 〒6794124, JP)
Application Number:
JP2018/040399
Publication Date:
May 09, 2019
Filing Date:
October 30, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NAGASE CHEMTEX CORPORATION (1-17, Shinmachi 1-chome Nishi-ku, Osaka-sh, Osaka 68, 〒5508668, JP)
International Classes:
H01L23/29; H01L21/56; H01L23/31; H03H3/08; H03H9/25
Foreign References:
JP2015179814A2015-10-08
JP2015076444A2015-04-20
JP2017149875A2017-08-31
JP2017092103A2017-05-25
JP2015220241A2015-12-07
Attorney, Agent or Firm:
KAWASAKI, HASHIMOTO AND PARTNERS (Kitahama-Yamamoto Building, 3-6 Kitahama 2-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
Download PDF: