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Title:
METHOD FOR PRODUCING PERFORATED METAL FOIL
Document Type and Number:
WIPO Patent Application WO/2013/058289
Kind Code:
A1
Abstract:
This method for producing a perforated metal foil is characterized by including: a conductive substrate preparation step (S10) for preparing a conductive substrate having a structure of an insulating layer being formed at a second region corresponding to the position of a perforation; a metal foil formation step (S20) for forming a metal foil by means of electrodeposition at a first region, to which the insulating layer has not been formed, of the conductive substrate; an insulating layer elimination step (S30) for eliminating the insulating layer; and a metal foil peeling step (S40) for peeling the metal foil from the conductive substrate; the insulating layer being eliminated while imparting minute vibrations to the insulating layer in the insulating layer elimination step (S30). By means of the method for producing a perforated metal foil, it is possible to stably produce a high-quality perforated metal foil as the perforation shape and perforation dimensions no longer degrade in the production process.

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Inventors:
KATO KAZUHIKO (JP)
HANYU SHINICHI (JP)
KATO SOICHIRO (JP)
Application Number:
PCT/JP2012/076864
Publication Date:
April 25, 2013
Filing Date:
October 17, 2012
Export Citation:
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Assignee:
BEAC CO LTD (JP)
International Classes:
C25D1/08; C25D1/04
Foreign References:
JPS5492527A1979-07-21
JPS61124600A1986-06-12
JP2006016654A2006-01-19
JP2007070703A2007-03-22
JPH01222084A1989-09-05
JPS6187889A1986-05-06
JPS5382626A1978-07-21
JPS4733036A
Attorney, Agent or Firm:
MATSUO, NOBUTAKA (JP)
Masatake Matsuo (JP)
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Claims:



 
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