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Title:
METHOD FOR PRODUCING PLANARIZATION FILM, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE COMPOSITION FOR FORMING PLANARIZATION FILM, PLANARIZATION FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/150094
Kind Code:
A1
Abstract:
Provided are: a method for producing a planarization film, which is capable of forming a planarization film having excellent planarization properties; an active light sensitive or radiation sensitive composition for forming a planarization film; a planarization film; and a method for manufacturing an electronic device. This method for producing a planarization film comprises: a step A for forming a film on a stepped substrate with use of a composition that contains a resin (A) and a photoacid generator (B); a step B for exposing the film to light through a mask that is arranged in a position corresponding to a projected part of the stepped substrate; and a step C for obtaining a planarization film by removing the film provided on the projected part of the stepped substrate with use of a developer liquid. In this connection, the γ value of a test film that is obtained using the above-described composition is less than 1,000.

Inventors:
YONEKUTA YASUNORI (JP)
KOSHIJIMA KOSUKE (JP)
Application Number:
PCT/JP2017/004367
Publication Date:
September 08, 2017
Filing Date:
February 07, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; G03F7/004; G03F7/09; G03F7/20; H01L21/027
Foreign References:
JP2002014477A2002-01-18
JPH09167753A1997-06-24
JP2013156627A2013-08-15
JP2003057828A2003-02-28
JP2005156816A2005-06-16
JP2008065303A2008-03-21
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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