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Title:
METHOD FOR PRODUCING PLATED MATERIAL, AND PLATED MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/207975
Kind Code:
A1
Abstract:
Provided are: a plated material which has excellent abrasion resistance, electrical conductivity and sliding performance and low friction, and in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The present invention is a method for producing a plated material, said method being characterized by comprising: a first step of removing at least a part of a reflow tin plating layer from a metallic base material, wherein the metallic base material has the reflow tin plating layer on at least a part thereof and a reactive layer is provided at the interface between the reflow tin plating layer and the metallic base material; a second step of subjecting at least a part of a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of subjecting at least a part of a nickel plating layer formed by the nickel plating treatment to a silver strike plating treatment; and a fourth step of subjecting at least a part of a region on which the silver strike plating treatment has been applied to a silver plating treatment.

Inventors:
TAKAHASHI HIROYOSHI (JP)
Application Number:
PCT/JP2014/002169
Publication Date:
December 31, 2014
Filing Date:
April 16, 2014
Export Citation:
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Assignee:
ORIENTAL ELECTRO PLATING CORP (JP)
International Classes:
C25D5/12; C25D5/50; C25D7/00; H01R13/03
Foreign References:
JP2010198780A2010-09-09
JP2011202266A2011-10-13
JP2010232681A2010-10-14
JPS60228695A1985-11-13
JP2009057630A2009-03-19
Attorney, Agent or Firm:
NAKA, Koichi et al. (JP)
Relations Koichi (JP)
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