METHOD FOR PRODUCING POLYIMIDE PRECURSOR, METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED OBJECT, METHOD FOR PRODUCING INTERLAYER DIELECTRIC FILM, COVER COAT LAYER, OR SURFACE-PROTECTIVE FILM, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

WIPO Patent Application WO/2019/193647

A1

A method for producing a polyimide precursor having a structural unit represented by formula (1), the method comprising steps (i) and (ii), the step (i) and/or the step (ii) being conducted in a solvent comprising a compound having both an ether bond and an amide bond. (i) A step in which a carboxylic acid anhydride is reacted with a diamine compound to obtain a polyimide precursor having a structural unit represented by formula (2). (ii) A step in which the polyimide precursor having a structural unit represented by formula (2) is reacted with the compound represented by formula (8) and the resultant reaction product is reacted with a compound represented by formula (9) to obtain a polyimide precursor having a structural unit represented by formula (1). (In formula (1), R1 and/or R2 is a group represented by formula (3).)

YONEDA SATOSHI (JP)
ENOMOTO TETSUYA (JP)

PCT/JP2018/014273

October 10, 2019

April 03, 2018

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HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP)

C08G73/10; C08F290/06; G03F7/027; G03F7/40

WO2016147958A1	2016-09-22
WO2015012385A1	2015-01-29
WO2018038309A1	2018-03-01

JP2003122004A	2003-04-25
JP2001125266A	2001-05-11
JP2001214057A	2001-08-07
JP2017517582A	2017-06-29
JPS61254547A	1986-11-12
JP2001154365A	2001-06-08

HEIWA INTERNATIONAL PATENT OFFICE (JP)

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